on the same board where surface mount soldering occurs, making it indispensable for high-density and high-frequency applications. Enhanced Shelf Life:
To comply with the specification, manufacturers must use precise metrology tools to verify layer thicknesses and structural integrity. ipc4556 pdf
Barrier against copper diffusion; provides mechanical support for holes. (118.1 – 236.2 µin) Electroless Palladium (Pd) on the same board where surface mount soldering