Traditional leaded packages rely on exposed peripheral leads. In contrast, BGAs place connections underneath the component body. IPC-7095 outlines strict criteria for:
Because BGA joints are hidden, the process must be strictly controlled to ensure "quality by design". ipc-7095 pdf
Introduced significant updates for mission-critical assemblies. Traditional leaded packages rely on exposed peripheral leads
Addressing the higher processing temperatures and wetting differences of SAC alloys (Tin-Silver-Copper). ipc-7095 pdf